| PART |
Description |
Maker |
| AM41DL6408H8H85IT AM41DL6408H AM41DL6408H8H70IS AM |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| AM49DL640BH |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| DS42516 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
| A82DL1622T |
(A82DL16x2T) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMIC Technology
|
| AM70PDLI29BDH |
(AM70PDLI27BDH / AM70PDLI29BDH) Stacked Multi-Chip Package (MCP/XIP) Flash Memory
|
SPANSION
|
| S71WS-N S71WS512NB0BFWYP3 S71WS512NB0BAWAP3 S71WS5 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84
Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品（MCP
|
Spansion Inc.
Spansion, Inc.
|
| M6MGE13VW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGB64BM34CWG M6MGT64BM34CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13TW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| AM50DL128CG85IS |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM SPECIALTY MEMORY CIRCUIT, PBGA88
|
Spansion, Inc.
|
| AM29DL323D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
